Epoxy Moulding Compound
Schematic of an Electronic Package
The microelectronics industry has been growing rapidly in size as well as its importance. Plastic materials have successfully replaced conventional packaging materials such as metals and ceramics for encapsulation of microelectronics devices. Developments in plastic packaging materials play very important role in the growth of the microelectronics industry.
The main advantage is low cost, ease of processing, and excellent electrical properties. Epoxy resins are widely used for formulating the moulding compounds for encapsulation. However, the relatively higher thermal expansion of epoxy induces internal stress in the package during it's use. Inorganic fillers such as fused silica have been in use to lower the thermal expansion of EMC. Also, epoxy compounds are too brittle, and tends to fail physically during the usage and handling. In practice various types of rubbers are incorporated in EMC to toughen the compound. However, the commercial rubbers, so called stress modifiers, increase the moisture uptake of the EMC. The absorbed moisture have number af demerits. Moisture induces delamination of the chip from the EMC by a mechanism called 'pop-corning effect'. Also it induces microcracks in the package which leads to premature failure of the package.
During the M. Eng. degree, my Research was focused on developing new stress modifiers (rubbers) to modify epoxy moulding compound in order to improve it's toughness as well as it's moisture resistance. I synthesised various types of Polyurethane based stress modifiers and incorporated them into EMC successfully. Significant improvements in the toughness and moisture resistance of EMC was observed.
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